Overview of the CASE Training Course
Flash Memory - In this module, we will discuss how flash memory is used and how data is stored within mobile devices. Students will be familiar with flash memory concerns such as wear leveling and garbage collection.
Chip Off Theory - In this module we will discuss the practical implications of chipping off a mobile device.
Tools and Equipment - In this module we will discuss the equipment needed to safely prepare a mobile device for chip off, equipment needed to safely remove the chip, and items needed for post processing
Phone Disassembly - In this module, we will discuss safe methods to take apart a mobile device.
NAND Chip Removal - In this module we will discuss and perform removal of NAND flash memory from a mobile device using a milling process.
Dediprog Software - In this module, we will install and configure the Dediprog Chip reader used to process certain NAND and eMMC chips.
eMMC/eMCP Chip Removal - In this lesson, we will remove the memory chip from a modem device using eMMC or eMCP flash memory using milling or polishing.
Z3X Pro Imaging - In this module we will use a Z3X Pro and MOORC Emates Pro adapter to image the chip as an eMMC device. We will demonstrate using the Z3X Pro to directly read damaged chip in certain circumstances.
Sireda - In this module, we will discuss using the branded adapters to read data from the eMMC/CP flash memory and the benefits.
Introduction to Physical Analyzer - In this module, we will use Physical Analyzer to process the extracted data from the flash memory chip.
Lap and Polishing - In this module we will use a polisher to remove the PCB from underneath the eMMC/eMCP chip, preventing heat from damaging the chip.
Practical - In this module, we will start with a device which must have the chip removed to process the data. The student can use either method learned in the course. A report of results will be prepared at the end.
|8065 Leesburg Pike, Suite T3-302, Vienna, Virginia 88182|
|Washington Dulles International Airport|